Demand for OLED materials, IC backend services emerging in China
Julian Ho, Taipei; Steve Shen, DIGITIMES
Taiwan-based LCD driver IC-design houses, driver IC backend service companies and IC material suppliers are likely to benefit significantly from the ramp-up of OLED panel production capacity in China after 2019, according to industry sources.
While Korea’s Samsung Display and LG Display are currently dominating the global OLED panel market, China’s flat panel makers including BOE Technology, China Star Optoelectronics Technology (CSOT), Everdisplay Technology, Visionox, Truly Optoelectronics, Tianma Microelectronics, Kunshan Govisionox Optoelectronics (GVO) and Royole, have all stepped into the sector, the sources indicated.
Taiwan-based COF (chip on film) packaging service providers for OLED driver ICs, including Chipbond Technology and ChipMOS Technologies, are ready to secure more windfall orders from these China-based panel makers when more and more OLED panel production lines kick off commercial production in 2019, said the sources.
Sources from both Chipbond and ChipMOS believe that COF is set to replace COG (chip-on-glass) to become the mainstream packaging process for OLED driver ICs for small-size smartphone panels in 2019.
Having seen its sales grow nearly 30% on year in the first half of 2018, semiconductor materials supplier Wah Lee Industrial is expected to see its momentum continue in the second half amid rising demand for related OLED equipment and materials, said the sources.
Buoyed by its established distribution channels in China, Wah Lee’s sales of OLED busines line alone expanded by 2.5-fold in the first half of 2018, indicating the booming demand for related OLED products in China, commented the sources.
from DIGITIMES: IT news from Asia https://ift.tt/2zJTgl0
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